The **ATS-05D-85-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 22.98°C/W (at 100 LFM) to 6.10°C/W (at 600 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Airflow Direction** | Horizontal (Spread Fin design) | --- ### 2. Key Features and Components #### A. The maxiFLOW™ Geometry The "85" in the part number refers to a specific fin pattern. This design features a flared-fin profile that maximizes surface area for convective heat transfer while minimizing pressure drop. This is critical for high-density PCB environments where airflow might be restricted. #### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or simple clips, this model uses a **pushPIN™** system: * **Spring-loaded mechanism:** Ensures constant, uniform pressure on the electronic component (TIM - Thermal Interface Material). * **Reliability:** Resistant to vibration and shock, making it suitable for industrial or telecommunications hardware. #### C. C3-R0 Suffix Meaning * **C3:** This typically denotes the specific thermal interface material (TIM) or hardware configuration. In this case, it usually implies the unit comes with **T766 phase-change material** or a high-performance thermal pad pre-applied to the base. * **R0:** This is the revision code or RoHS compliance indicator, ensuring the part is lead-free and meets environmental safety standards. --- ### 3. Application Use Cases This part is generally found in the following electronic systems: 1. **Network Switches/Routers:** Cooling ASICs that process high-speed data. 2. **Power Supplies:** Managing heat for MOSFETs or power regulators. 3. **Embedded Systems:** Cooling processors in compact industrial PCs where height (10mm profile) is a constraint. ---