The **ATS-05D-90-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is specifically designed for component cooling in electronic assemblies. --- ### 1. Technical Specifications The following table summarizes the core technical attributes of this specific part: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-05D-90-C2-R0 | | **Attachment Method** | pushPIN™ | | **Fin Type** | Straight Fin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 6.36°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | --- ### 2. Key Electronic & Mechanical Features #### A. Attachment System: pushPIN™ Unlike standard adhesive-based heat sinks, this part uses a **pushPIN™** mechanism. * **Spring-loaded:** It ensures consistent pressure across the interface for optimal heat transfer. * **Compression Spring:** Provides a secure fit that resists vibration and mechanical shock, making it ideal for industrial or automotive electronics. #### B. Thermal Interface Material (TIM) The "C2" in the part number indicates that it comes pre-applied with **T766 Phase Change Material**. * **Function:** This material fills microscopic air gaps between the electronic component (CPU, FPGA, or MOSFET) and the heat sink base. * **Benefit:** Reduces thermal contact resistance significantly compared to dry mounting. #### C. Fin Design and Airflow The straight fin design is optimized for **forced air cooling**. * **LFM Performance:** At higher airflows (e.g., 700 LFM), the thermal resistance drops from 6.36°C/W down to approximately 1.60°C/W. * **Material:** The use of Aluminum 6063 provides a balance between lightweight construction and high thermal conductivity. --- ### 3. Common Applications This heat sink is typically found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed data processors. 2. **Embedded Systems:** Protecting SoCs (System on Chips) from thermal throttling. 3. **Power Electronics:** Managing heat in power supplies or motor controllers.