The **ATS-05D-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Thermal Resistance** | 22.00°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Design and Components The "ATS-05D-91-C3-R0" features several key electronic-mechanical design elements: * **Push-Pin Attachment:** The part includes a flexible "Push-Pin" mounting system. This allows for quick and secure attachment to a PCB through pre-drilled holes, providing consistent pressure on the electronic component for optimal heat transfer. * **Thermal Interface Material (TIM):** This specific model typically comes with **T412** thermal tape or grease pre-applied to the base to fill microscopic air gaps between the heat sink and the chip. * **Fin Geometry:** The straight-fin design is optimized for high-density airflow environments. The 10mm low-profile height makes it suitable for compact electronic enclosures (1U servers or thin clients). --- ### 3. Part Number Breakdown Understanding the nomenclature helps identify the exact features of the component: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **05** | Push-Pin type/series | | **D** | Material/Spring type | | **91** | Specific dimension code (40x40x10mm) | | **C3** | Thermal Interface Material (TIM) type | | **R0** | RoHS compliance and revision status | --- ### 4. Typical Applications * **Embedded Systems:** Cooling microprocessors in industrial PCs. * **Telecommunications:** Heat dissipation for high-speed networking chips. * **Power Electronics:** Managing heat for Voltage Regulators (VRMs) or MOSFETs.