The **ATS-05D-92-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push pin" attachment series designed to cool electronic components like CPUs, GPUs, and high-power chipsets. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-05D-92-C2-R0 | | **Material** | Aluminum (Body) | | **Finish** | Blue Anodized | | **Attachment Type** | Push Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 16.48 °C/W (at 100 LFM) to 5.67 °C/W (at 800 LFM) | | **Fin Type** | Straight Fin | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### Key Components & Electronic Functionality #### 1. Heat Dissipation (Passive Cooling) While not an electronic component itself (it contains no circuitry), the ATS-05D-92-C2-R0 is critical for the thermal management of electronics. It functions by increasing the surface area of a hot component, allowing heat to transfer into the surrounding air more efficiently. #### 2. Push Pin Mounting System The "C2" in the part number refers to the mounting kit. This assembly uses: * **Plastic/Brass Push Pins:** These snap into holes on the PCB (Printed Circuit Board). * **Compression Springs:** These ensure constant pressure (Force) between the heat sink and the chip, which is vital for minimizing thermal resistance. #### 3. Thermal Interface Material (TIM) The base of this heat sink comes pre-applied with **T766**. This is a thermal pad or paste that fills microscopic air gaps between the heat sink and the electronic chip (IC), ensuring maximum heat transfer. #### 4. Blue Anodized Finish The blue coating is not just for aesthetics; anodizing increases the emissivity of the aluminum surface and provides electrical insulation, preventing the metal sink from shorting out nearby components if it accidentally touches a lead. --- ### Use Cases in Electronics * **Embedded Systems:** Used on processors that generate moderate heat in compact enclosures. * **Telecommunications:** Cooling for FPGA or ASIC chips on networking cards. * **Power Supplies:** Managing heat for high-voltage regulators or transistors. ---