The **ATS-05D-93-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series. --- ### 1. Technical Specifications The following table highlights the critical mechanical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Thermal Resistance (Unducted)** | 7.37 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.39 °C/W @ 100 LFM | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Breakdown #### A. Fin Configuration The "93" in the part number designates a specific fin pattern. This model features a **Straight Fin** design, which is ideal for applications where the airflow direction is predictable. #### B. Attachment Mechanism The **pushPIN™** system is an electronic assembly feature designed to provide: * **Constant Pressure:** A high-performance compression spring ensures consistent contact between the heat sink and the component (CPU, GPU, or MOSFET). * **Ease of Installation:** It uses a push-rivet system that snaps into pre-drilled holes on the PCB, reducing the risk of mechanical damage compared to screw-based mounts. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-conductivity thermal grease/pad that fills microscopic air gaps between the heat sink and the electronic chip, significantly lowering thermal impedance. --- ### 3. Applications This part is commonly found in the following electronic environments: * **Telecommunications:** Cooling of high-speed processing chips. * **Industrial PCs:** Thermal management for embedded controllers. * **Power Supplies:** Heat dissipation for power transistors and voltage regulators. ---