ATS-05E-35-C2-R0
AI

The **ATS-05E-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient heat dissipation in electronic assemblies.
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### 1. Technical Specifications
Below are the primary mechanical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Plastic Pins & Springs) |
| **Thermal Resistance (Unducted)** | 12.83 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 1.82 °C/W @ 100 LFM |
| **Dimensions (L x W x H)** | 35mm x 35mm x 10mm |
| **Fin Pattern** | Fine Pitch (Cross-Cut) |
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### 2. Breakdown of the Part Number
The nomenclature follows a specific logic used by Advanced Thermal Solutions:
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **05**: Heat sink series.
* **E**: Fin pitch / style.
* **35**: Length/Width dimension (35mm).
* **C2**: Material and Thermal Interface Material (TIM) configuration.
* **R0**: Revision/Packaging code.
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### 3. Key Electronic Functions
The ATS-05E-35-C2-R0 serves several critical functions in an electronic circuit:
1. **Thermal Dissipation**: It increases the surface area of a heat-generating component (like a BGA, FPGA, or CPU), allowing air to carry away heat more effectively.
2. **Mechanical Security**: The **pushPIN™** system ensures a precise and constant pressure is applied to the component, which is vital for maintaining the integrity of the solder joints and the thermal interface material.
3. **Thermal Interface**: These units typically come with a pre-applied **Thermal Interface Material (TIM)** on the base to fill microscopic air gaps between the heat source and the sink.
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### 4. Mounting Example
The mounting process involves using pre-drilled holes in the PCB. Here is a conceptual representation of the assembly logic:
```markdown
PCB Layout Requirements:
1. Target Component: 35mm footprint
2. Hole Pattern: 40mm x 40mm (Pitch)
3. Hole Diameter: 3.175mm (typical for pushPIN)
```
- ⤷
What is the difference between ducted and unducted thermal resistance?
- ⤷ Can the pushPIN attachment be reused if the heat sink is removed?
- ⤷ What type of Thermal Interface Material (TIM) is pre-applied to this model?