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  • ATS-05E-35-C2-R0

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    The **ATS-05E-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient heat dissipation in electronic assemblies. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic Pins & Springs) | | **Thermal Resistance (Unducted)** | 12.83 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.82 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Fin Pattern** | Fine Pitch (Cross-Cut) | --- ### 2. Breakdown of the Part Number The nomenclature follows a specific logic used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **05**: Heat sink series. * **E**: Fin pitch / style. * **35**: Length/Width dimension (35mm). * **C2**: Material and Thermal Interface Material (TIM) configuration. * **R0**: Revision/Packaging code. --- ### 3. Key Electronic Functions The ATS-05E-35-C2-R0 serves several critical functions in an electronic circuit: 1. **Thermal Dissipation**: It increases the surface area of a heat-generating component (like a BGA, FPGA, or CPU), allowing air to carry away heat more effectively. 2. **Mechanical Security**: The **pushPIN™** system ensures a precise and constant pressure is applied to the component, which is vital for maintaining the integrity of the solder joints and the thermal interface material. 3. **Thermal Interface**: These units typically come with a pre-applied **Thermal Interface Material (TIM)** on the base to fill microscopic air gaps between the heat source and the sink. --- ### 4. Mounting Example The mounting process involves using pre-drilled holes in the PCB. Here is a conceptual representation of the assembly logic: ```markdown PCB Layout Requirements: 1. Target Component: 35mm footprint 2. Hole Pattern: 40mm x 40mm (Pitch) 3. Hole Diameter: 3.175mm (typical for pushPIN) ```
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted thermal resistance?
    • ⤷ Can the pushPIN attachment be reused if the heat sink is removed?
    • ⤷ What type of Thermal Interface Material (TIM) is pre-applied to this model?