The **ATS-05E-72-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is a breakdown of its core specifications: | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Push-pin style) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height (H)** | 25.00 mm | | **Pitch (Fins)** | XC (Extra Coarse / High Flow) | | **Thermal Resistance** | ~5.11 °C/W (at 100 LFM) | | **Attachment Method** | Push-Pin with Compression Spring | --- ### 2. Key Component Features #### A. The Fin Design (XC Series) The "XC" or Extra Coarse fin design is optimized for environments where airflow might be slightly restricted or where high-velocity air is provided by system fans. The gaps between the aluminum fins are spaced to minimize pressure drop while maximizing surface area for heat dissipation. #### B. Push-Pin Mounting System Instead of using messy thermal adhesives or complex brackets, this part uses the **pushPIN™** system: * **Ease of Install:** Uses pre-drilled holes in the PCB. * **Constant Pressure:** A brass or plastic pin combined with a stainless steel spring ensures consistent contact pressure between the heat sink and the component, improving thermal transfer. #### C. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and structural integrity. * **Blue Anodized Coating:** This is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiant heat transfer and providing corrosion resistance. --- ### 3. Thermal Performance Reference Thermal performance varies based on the Airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 5.11 | | 300 | 1.5 | 1.78 | | 500 | 2.5 | 1.15 | --- ### 4. Implementation Details To use this part in an electronic design, the PCB must have a specific hole pattern. * **Hole Pitch:** Approximately 38.00 mm (center-to-center). * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied—a high-performance phase-change material or thermal grease to fill microscopic air gaps between the heat sink and the chip.