The **ATS-05F-01-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It belongs to the *pushPIN™* series manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimension (Length x Width)** | 40.00 mm x 40.00 mm | | **Height** | 10.00 mm | | **Pitch** | Fine-Pitch | | **Thermal Resistance** | 21.93 °C/W (Unducted @ 100 LFM) | --- ### 2. Key Component Features * **PushPIN™ Attachment:** This part uses a specialized attachment mechanism consisting of a brass or plastic pin and a high-performance compression spring. This ensures consistent pressure on the thermal interface material (TIM) for optimal heat transfer. * **Straight Fin Design:** The "F" in the part number denotes a straight fin pattern. This is ideal for applications where airflow is directed through the fins, providing a high surface area-to-volume ratio. * **Low Profile:** With a height of only 10mm, this heatsink is designed for "Low Profile" applications where vertical space is limited, such as in 1U servers or slim networking gear. * **Pre-assembled TIM:** Usually, these parts come with a pre-applied Thermal Interface Material to simplify the assembly process on the production line. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code helps in identifying the specific configuration: | Segment | Meaning | Detail | | :--- | :--- | :--- | | **ATS** | Manufacturer | Advanced Thermal Solutions | | **05** | Series | pushPIN™ Heat Sink | | **F** | Fin Type | Straight Fin (Fine Pitch) | | **01** | Size | Refers to specific length/width dimensions | | **C2** | Thermal Performance | Indicates the specific thermal resistance rating | | **R0** | Finish/Color | Blue Anodized | --- ### 4. Application Use-Cases Electronic engineers select the ATS-05F-01-C2-R0 for: 1. **BGA Cooling:** Ball Grid Array components that generate significant heat. 2. **FPGA/CPU Cooling:** Processing units in telecommunications or industrial automation. 3. **Space-Constrained Devices:** When the height of the enclosure prevents using standard 25mm+ heatsinks.