The **ATS-05F-12-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs). --- ## 1. Technical Specifications Below are the primary technical parameters for this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Heat Sink Type** | Fine Pitch (XC Cut) | | **Thermal Resistance** | 15.84 °C/W (at 100 LFM) | | **Dimensions** | 50mm x 50mm x 15mm | | **Weight** | 63.63 grams | --- ## 2. Key Components & Design The "electronic" functionality of this part is passive, focusing on heat dissipation via conduction and convection. ### A. The Heat Sink Body * **Fin Design:** It uses a "Fine Pitch" square-pin or cross-cut geometry. This increases the surface area significantly without obstructing airflow, making it ideal for systems with high-density component layouts. * **Material:** AL6063 aluminum provides high thermal conductivity and is lightweight, preventing mechanical stress on the PCB. ### B. The Attachment Mechanism (pushPIN™) * **Push Pins:** These are plastic or metal pins that go through pre-drilled holes in the PCB. * **Springs:** These ensure a consistent **Compressive Force**, which is critical for maintaining an airtight interface between the chip and the heat sink. * **Compatibility:** The `-R0` suffix indicates a standard industry-standard mounting hole pattern (typically 43mm x 43mm for this size). ### C. Thermal Interface Material (TIM) * The part usually comes pre-applied with a **Thermal Interface Material** (like T766). This fills the microscopic air gaps between the electronic component (CPU/GPU/FPGA) and the heat sink base to maximize heat transfer. --- ## 3. Performance Data (Airflow) Thermal performance varies based on the Velocity of air (LFM - Linear Feet per Minute): | Air Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 15.84 °C/W | | **300 LFM (1.5 m/s)** | 5.57 °C/W | | **500 LFM (2.5 m/s)** | 3.99 °C/W | | **700 LFM (3.5 m/s)** | 3.23 °C/W | --- ## 4. Part Number Breakdown Understanding the nomenclature helps in selecting the correct variant: * **ATS:** Advanced Thermal Solutions (Manufacturer) * **05:** Series/Style * **F:** Fin Pitch (Fine) * **12:** Heat Sink Height (15mm) * **C2:** Thermal Interface Material / Color (Blue Anodized) * **R0:** Revision/Standard version