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  • ATS-05F-127-C2-R0

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    The **ATS-05F-127-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin pattern, and material properties. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Fin Type** | Straight / Square | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 20.00mm | | **Thermal Resistance** | 3.84°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Design Features * **pushPIN™ Attachment:** This model uses a spring-loaded "push-pin" mechanism. This ensures a consistent and specific amount of pressure is applied to the chip, improving heat transfer and preventing damage from over-tightening. * **Square Fin Design:** The fin structure is optimized for vertical or horizontal airflow. The 20mm height provides a balance between high surface area for cooling and a low profile for tight chassis spaces. * **Blue Anodized Coating:** The blue finish isn't just aesthetic; anodizing increases the surface emissivity, which slightly improves heat dissipation through radiation and protects the aluminum from corrosion. --- ### 3. Key Electronic Functions While the heat sink itself is passive (it has no moving parts), it serves critical electronic roles: 1. **Thermal Management:** It prevents "Thermal Throttling," where an electronic component slows its clock speed to prevent melting. 2. **Reliability:** By maintaining a lower junction temperature ($T_j$), it extends the Mean Time Between Failures (MTBF) of the semiconductor it is attached to. 3. **EMI Shielding:** In some configurations, a grounded aluminum heat sink can act as a minor shield against Electromagnetic Interference (EMI). --- ### 4. Comparison to Similar Models | Part Number | Height | Thermal Resistance (100 LFM) | | :--- | :--- | :--- | | **ATS-05F-127-C2-R0** | **20.00mm** | **3.84°C/W** | | ATS-05F-126-C2-R0 | 15.00mm | 5.37°C/W | | ATS-05F-128-C2-R0 | 25.00mm | 2.91°C/W | ---
    ✨ Follow-up Questions
    • ⤷ What are the specific mounting hole requirements for the pushPIN system?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?
    • ⤷ Can this heat sink be used with active cooling fans?