The **ATS-05F-144-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (with Springs) | | **Thermal Resistance** | 2.93 °C/W (at 100 LFM) | | **Flow Orientation** | Fine-Pitch (Cross-Cut) | --- ### Physical Dimensions | Dimension | Measurement | | :--- | :--- | | **Height (Off Base)** | 25.00 mm | | **Length (Width/Depth)** | 30.00 mm x 30.00 mm | | **Mounting Hole Spacing** | 35.00 mm (diagonal/center-to-center) | | **Pitch** | Fine Pitch (maximizing surface area) | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Body (Aluminum) The body is constructed from aluminum for its high thermal conductivity and lightweight properties. The "Fine Pitch" design utilizes multiple fins to increase the total surface area, allowing heat to dissipate more quickly into the surrounding air via convection. #### 2. Push Pin Mounting System Instead of using messy adhesives or thermal tape, this part uses a mechanical **Push Pin** system. * **Springs:** Ensure constant pressure (downward force) between the heat sink and the electronic chip. * **Compression:** This pressure minimizes the air gaps between the chip and the heat sink, optimizing thermal transfer. #### 3. Thermal Interface Material (TIM) Usually, these parts come with a pre-applied **Phase Change Material (PCM)** or high-performance thermal grease on the base. This fills the microscopic imperfections on the surface of the processor to ensure the heat moves efficiently from the silicon to the aluminum. --- ### Common Applications * **Voltage Regulator Modules (VRMs):** Managing heat in power delivery systems. * **Processors/FPGAs:** Cooling small-form-factor integrated circuits. * **Embedded Systems:** Used in industrial PCs where airflow might be limited and reliable mounting is required.