The **ATS-05F-147-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Fin Style** | Straight (High-density) | | **Thermal Resistance** | 13.65°C/W (Unducted Flow @ 200 LFM) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the cooling capability and mounting hardware: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **05**: Refers to the push-pin series. * **F**: Likely indicates the specific fin density or material grade. * **147**: Designates the specific footprint and geometry (35mm x 35mm). * **C3**: Indicates the Thermal Interface Material (TIM) and spring tension. In this case, **C3** typically means **T412 Phase Change Material** is pre-applied. * **R0**: Revision code (RoHS compliant). --- ### 3. Key Features & Electronic Application #### A. Attachment System The **Push-Pin** mechanism uses a flexible brass or plastic pin with a compression spring. This provides several electronic advantages: * **Uniform Pressure:** Ensures consistent contact between the heat sink and the electronic chip, optimizing heat transfer. * **Vibration Resistance:** Securely holds the component in place during mechanical shock. * **Ease of Assembly:** Can be installed into pre-drilled holes on the PCB without specialized tools. #### B. Thermal Interface Material (TIM) The **C3** designation indicates that the base comes with a pre-applied **T412** coating. This eliminates the need for manual thermal paste application, reducing manufacturing errors and ensuring low thermal impedance. #### C. Material and Coating The **Blue Anodized Aluminum** is not just for aesthetics; the anodization process increases the surface emissivity, which improves heat dissipation via radiation, while also providing a layer of electrical insulation/corrosion resistance. --- ### 4. Ideal Use Cases This specific part is frequently found in: 1. **Networking Hardware:** Switches and routers where airflow is constant. 2. **Embedded Systems:** Industrial PCs with limited vertical clearance (only 10mm high). 3. **Power Supplies:** Cooling voltage regulators or MOSFET arrays.