ATS-05F-150-C2-R0
AI

The **ATS-05F-150-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **push-pin** attachment series, specifically designed for cooling electronic components like CPUs, GPUs, or high-power semiconductors.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Al) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 35mm x 35mm x 25mm |
| **Thermal Resistance** | 4.82°C/W (@ 200 LFM) |
| **Attachment Method** | Push-Pin (Brass) |
| **Interface Material** | T766 (Phase Change Material) |
| **Fin Style** | Straight Fin |
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### 2. Breakdown of the Part Number
The part number follows a specific nomenclature used by Advanced Thermal Solutions to identify its properties:
* **ATS**: Manufacturer prefix (Advanced Thermal Solutions).
* **05F**: Series identifier (typically indicating specific fin configurations).
* **150**: Height code (25mm in this instance).
* **C2**: Color and Finish (Blue Anodized).
* **R0**: Revision or RoHS compliance status.
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### 3. Key Electronic Functions
While the heat sink itself is passive (it has no electrical circuits), its role in an electronic system is critical:
1. **Thermal Management**: It increases the surface area of a heat-generating component, allowing for more efficient heat dissipation into the surrounding air via convection.
2. **Overheating Protection**: By keeping the junction temperature ($T_j$) of a semiconductor within limits, it prevents thermal throttling or permanent damage.
3. **EMI Shielding (Incidental)**: In some designs, grounded aluminum heat sinks can help reduce electromagnetic interference, though this is secondary to cooling.
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### 4. Installation & Compatibility
The **Push-Pin** system (with a brass pin and stainless steel spring) provides:
* **Constant Pressure**: Ensures the heat sink remains firmly against the chip, improving thermal transfer.
* **Ease of Assembly**: Can be installed into pre-drilled holes in the PCB without tools.
* **Compatibility**: Designed for standard hole patterns commonly found on motherboards or industrial control units.
- ⤷What is the thermal conductivity of the T766 interface material used in this model?
- ⤷ How do I calculate the airflow requirements (LFM) for this specific heat sink?
- ⤷ Are there alternative attachment methods available for the same 35x35mm size?