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  • ATS-05F-150-C2-R0

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    The **ATS-05F-150-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **push-pin** attachment series, specifically designed for cooling electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35mm x 35mm x 25mm | | **Thermal Resistance** | 4.82°C/W (@ 200 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Interface Material** | T766 (Phase Change Material) | | **Fin Style** | Straight Fin | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions to identify its properties: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **05F**: Series identifier (typically indicating specific fin configurations). * **150**: Height code (25mm in this instance). * **C2**: Color and Finish (Blue Anodized). * **R0**: Revision or RoHS compliance status. --- ### 3. Key Electronic Functions While the heat sink itself is passive (it has no electrical circuits), its role in an electronic system is critical: 1. **Thermal Management**: It increases the surface area of a heat-generating component, allowing for more efficient heat dissipation into the surrounding air via convection. 2. **Overheating Protection**: By keeping the junction temperature ($T_j$) of a semiconductor within limits, it prevents thermal throttling or permanent damage. 3. **EMI Shielding (Incidental)**: In some designs, grounded aluminum heat sinks can help reduce electromagnetic interference, though this is secondary to cooling. --- ### 4. Installation & Compatibility The **Push-Pin** system (with a brass pin and stainless steel spring) provides: * **Constant Pressure**: Ensures the heat sink remains firmly against the chip, improving thermal transfer. * **Ease of Assembly**: Can be installed into pre-drilled holes in the PCB without tools. * **Compatibility**: Designed for standard hole patterns commonly found on motherboards or industrial control units.
    ✨ Follow-up Questions
    • ⤷What is the thermal conductivity of the T766 interface material used in this model?
    • ⤷ How do I calculate the airflow requirements (LFM) for this specific heat sink?
    • ⤷ Are there alternative attachment methods available for the same 35x35mm size?