The **ATS-05F-152-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series, designed for cooling electronic components like CPUs, GPUs, and other integrated circuits on a PCB. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 35mm x 35mm x 25mm | | **Thermal Resistance** | 3.32°C/W (at 200 LFM) | | **Attachment Method** | Push Pins (Plastic) with Springs | | **Fin Style** | XCUT (Cross-cut) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Characteristics The part is engineered to provide efficient cooling in confined spaces through several distinct features: * **XCUT Fin Design:** The fins are cut in both vertical and horizontal directions. This allows for multi-directional airflow, making it effective even if the air is not coming from a single fixed direction. * **Push Pin Attachment:** It uses a spring-loaded push pin mechanism. This ensures consistent pressure on the component being cooled, which optimizes the thermal transfer from the chip to the heat sink. * **Blue Anodized Finish:** Beyond aesthetics, the anodized coating provides surface protection and slightly increases emissivity for better radiative cooling. * **Integrated TIM:** The inclusion of **T766** thermal material means the part is "drop-in" ready; no additional thermal paste needs to be applied during the assembly process. --- ### 3. Application Use Cases This heat sink is typically found in: 1. **Networking Hardware:** Switches, routers, and modems. 2. **Industrial Controls:** Cooling processors in automation equipment. 3. **Power Supplies:** Managing heat for MOSFETs or power regulators. 4. **Embedded Systems:** Small form factor motherboards where vertical clearance is limited (25mm height). ---