ATS-05F-157-C2-R0
AI

The **ATS-05F-157-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS).
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## 1. Technical Specifications
This part is designed for cooling electronic components like CPUs, GPUs, or power transistors. Below are its primary technical characteristics:
| Property | Description |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | **pushPIN™** (Plastic pins with integrated springs) |
| **Thermal Resistance** | 3.35°C/W (at 200 LFM / 1.0 m/s) |
| **Dimensions (L x W x H)** | 40.00 mm x 40.00 mm x 30.00 mm |
| **Fin Style** | XC-CUT (Cross-cut / Straight fin) |
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## 2. Key Components & Design Features
### A. The pushPIN™ Attachment System
Unlike adhesive tapes or simple clips, the "05F" series uses the proprietary **pushPIN™** system.
- **Components:** It consists of a plastic pin and a compression spring.
- **Benefit:** It ensures constant, high pressure against the electronic component, which maximizes heat transfer (TIM performance). It also provides a secure mechanical lock to the PCB.
### B. XC-CUT Fin Design
The fins are designed with a "cross-cut" pattern.
- This creates more surface area compared to standard straight fins.
- It allows for better airflow from multiple directions, making it more efficient in systems where the cooling fan may not be perfectly aligned with the heat sink.
### C. Thermal Interface Material (TIM)
The "R0" suffix usually denotes that the part comes with **T766** pre-applied thermal phase-change material or a high-performance thermal pad. This eliminates the need for manual application of thermal paste during assembly.
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## 3. Part Number Breakdown
The nomenclature for ATS heat sinks follows a specific logic:
| Code Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer: Advanced Thermal Solutions |
| **05** | Attachment Type (pushPIN™ style) |
| **F** | Spring strength/type |
| **157** | Specific physical dimensions and fin count |
| **C2** | Material/Finish (Blue Anodized Aluminum) |
| **R0** | Revision/Thermal Pad variant |
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## 4. Operational Requirements
To function effectively, this part requires **forced air cooling**. In a "passive" environment (no fans), the thermal resistance increases significantly (approx. 7.18°C/W), which may lead to component overheating.
- ⤷
What is the hole-to-hole spacing required on the PCB for this heat sink?
- ⤷ Can this heat sink be used with a custom spring for higher pressure?
- ⤷ How does blue anodization affect the thermal performance compared to bare aluminum?