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  • ATS-05F-157-C2-R0

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    The **ATS-05F-157-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Technical Specifications This part is designed for cooling electronic components like CPUs, GPUs, or power transistors. Below are its primary technical characteristics: | Property | Description | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | **pushPIN™** (Plastic pins with integrated springs) | | **Thermal Resistance** | 3.35°C/W (at 200 LFM / 1.0 m/s) | | **Dimensions (L x W x H)** | 40.00 mm x 40.00 mm x 30.00 mm | | **Fin Style** | XC-CUT (Cross-cut / Straight fin) | --- ## 2. Key Components & Design Features ### A. The pushPIN™ Attachment System Unlike adhesive tapes or simple clips, the "05F" series uses the proprietary **pushPIN™** system. - **Components:** It consists of a plastic pin and a compression spring. - **Benefit:** It ensures constant, high pressure against the electronic component, which maximizes heat transfer (TIM performance). It also provides a secure mechanical lock to the PCB. ### B. XC-CUT Fin Design The fins are designed with a "cross-cut" pattern. - This creates more surface area compared to standard straight fins. - It allows for better airflow from multiple directions, making it more efficient in systems where the cooling fan may not be perfectly aligned with the heat sink. ### C. Thermal Interface Material (TIM) The "R0" suffix usually denotes that the part comes with **T766** pre-applied thermal phase-change material or a high-performance thermal pad. This eliminates the need for manual application of thermal paste during assembly. --- ## 3. Part Number Breakdown The nomenclature for ATS heat sinks follows a specific logic: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **05** | Attachment Type (pushPIN™ style) | | **F** | Spring strength/type | | **157** | Specific physical dimensions and fin count | | **C2** | Material/Finish (Blue Anodized Aluminum) | | **R0** | Revision/Thermal Pad variant | --- ## 4. Operational Requirements To function effectively, this part requires **forced air cooling**. In a "passive" environment (no fans), the thermal resistance increases significantly (approx. 7.18°C/W), which may lead to component overheating.
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole spacing required on the PCB for this heat sink?
    • ⤷ Can this heat sink be used with a custom spring for higher pressure?
    • ⤷ How does blue anodization affect the thermal performance compared to bare aluminum?