The **ATS-05F-164-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically for thermal management in electronic components like CPUs, GPUs, and power transistors. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 33mm | | **Thermal Resistance** | 2.41 °C/W (at 1.0 m/s airflow) | | **Fin Type** | XC-CUT (Cross-cut) | | **Pitch** | Fine Pitch | --- ### 2. Physical Design Components The assembly consists of three primary electronic packaging elements: * **Heat Sink Body:** A cross-cut (XC-CUT) aluminum block. The cross-cut design allows for multidirectional airflow, making it ideal for systems where air currents might be unpredictable or restricted. * **Push-Pins:** These are plastic or metal pins that snap into pre-drilled holes in the PCB. They provide a constant force, ensuring consistent contact between the component and the heat sink. * **Compression Springs:** Mounted on the pins, these springs ensure the correct amount of pressure (Force) is applied to prevent damage to the chip while maximizing heat transfer. --- ### 3. Electronic Application & Performance Thermal management is critical in electronics to prevent **thermal throttling** or permanent hardware failure. #### Thermal Performance Table The efficiency of the ATS-05F-164-C2-R0 scales based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (m/s) | 1.0 (200 LFM) | 1.5 (300 LFM) | 2.0 (400 LFM) | 2.5 (500 LFM) | | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 2.41 | 1.38 | 1.20 | 1.09 | #### Thermal Interface Material (TIM) The "C2" in the part number indicates that this unit comes pre-applied with **ATS-PPS-11**, a high-performance thermal interface material. This ensures that the microscopic air gaps between the component (heat source) and the heat sink are filled, significantly reducing contact resistance. --- ### 4. Mounting Hardware The product uses a **brass push-pin** system. Below is a summary of the mounting dimensions for PCB layout: ```text - Pitch (Distance between holes): 38.0mm - Pin Diameter: 3.0mm - Pin Material: Brass/Plastic - Recommended Hole Size: 3.2mm ``` ---