The **ATS-05F-167-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 9.10°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 10.00mm | | **Fin Pattern** | Straight | --- ### 2. Key Components & Features #### A. The pushPIN™ Attachment System The "05F" and "C2" in the part number often refer to the attachment kit. This model uses a specialized push-pin mechanism that: * Provides a **firm, consistent pressure** on the component, improving thermal interface material (TIM) performance. * Includes a **built-in spring** to prevent damage to the PCB during vibration or shock. #### B. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides electrical insulation and improves surface emissivity, which slightly enhances radiant heat transfer. #### C. Low Profile Design With a height of only **10.00mm**, this heat sink is specifically designed for: * **1U Rackmount servers** where vertical space is extremely limited. * **Embedded systems** and compact telecommunications hardware. --- ### 3. Performance Analysis The efficiency of the ATS-05F-167-C2-R0 is highly dependent on the "LFM" (Linear Feet per Minute) of airflow provided by system fans: * **At 100 LFM:** Thermal resistance is ~9.10°C/W. * **At 500 LFM:** Thermal resistance drops significantly to ~3.15°C/W. * **Conclusion:** This part is highly effective in forced-air environments but less efficient in purely passive (natural convection) setups. --- ### 4. Typical Applications * **Voltage Regulator Modules (VRMs)** * **FPGA and ASIC** cooling. * **Industrial PCs** (IPC) where vibration resistance is required. * **Network Switches** and high-speed routers.