The **ATS-05F-184-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for efficient cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary technical parameters for this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 4.14°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Fin Style** | Straight Fin | | **Weight** | ~35 grams | --- ### 2. Physical Design Details * **Fin Geometry:** It features vertical straight fins that maximize surface area while allowing air to flow through the channel, making it ideal for forced-air cooling environments. * **Base Material:** The aluminum construction offers a balance of lightweight design and high thermal conductivity. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **ATS-PPS-05**, a high-performance phase-change material that ensures minimal air gaps between the heat source and the sink. --- ### 3. Mounting System The "C2" in the part number refers to the mounting configuration: * **Push-Pins:** These provide the necessary force to ensure the heat sink stays in contact with the PCB. They are designed for 3.0mm diameter holes. * **Springs:** Included to provide consistent downward pressure, improving thermal transfer and preventing damage to the chip during vibration or mechanical shock. --- ### 4. Typical Applications The ATS-05F-184-C2-R0 is commonly used in: 1. **Networking Hardware:** Routers, switches, and base stations. 2. **Embedded Systems:** Industrial PCs and single-board computers. 3. **Processors:** Cooling CPUs, GPUs, or FPGAs with high TDP (Thermal Design Power) in constrained spaces.