The **ATS-05F-185-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to their "pushPIN™" family of thermal solutions. Below is a detailed breakdown of its specifications and electronic application characteristics. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-05F-185-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W)** | 40.00mm x 40.00mm | | **Height (Height off base)** | 25.00mm | | **Thermal Resistance** | 3.35°C/W (@ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Component Architecture #### A. Fin Design (Cross-Cut) The "F" in the part number indicates a **Cross-Cut** fin pattern. Unlike standard straight fins, cross-cut fins create more surface area and allow for air to move multidirectionally. This is critical for electronic enclosures where airflow direction might be inconsistent. #### B. Attachment Mechanism: pushPIN™ This part utilizes a specialized mounting system rather than adhesive tape: * **Brass Bolts/Plastic Pins:** Provides high pressure to ensure the thermal interface material (TIM) fills microscopic gaps between the chip and the heat sink. * **Compression Springs:** These maintain constant pressure over time, even during vibration or thermal expansion/contraction. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-performance phase-change material or grease that eliminates the need for manual application, reducing assembly time and ensuring optimal heat transfer from the semiconductor. --- ### 3. Electronic Application Use Cases This heat sink is typically used for cooling mid-to-high power electronic components, such as: 1. **Processors & FPGAs:** Ideal for Field Programmable Gate Arrays or CPUs in telecommunications equipment. 2. **ASICs:** Used in custom integrated circuits that generate significant heat in localized areas. 3. **Power Supplies:** Cooling MOSFETs or power transistors in industrial power converters. 4. **Embedded Systems:** Suitable for 1U or 2U server rack environments due to its 25mm height profile. --- ### 4. Thermal Performance Data (Airflow) Thermal resistance determines how many degrees the component temperature will rise per watt of power dissipated. | Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 3.35 | 1.70 | 1.30 | ---