The **ATS-05F-196-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm | | **Height (Off Base)** | 10mm | | **Thermal Resistance** | 18.11°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Interface Material** | T766 (Thermal Grease) | --- ### 2. Key Components & Design Features #### A. Fin Profile (Straight Fin) The part utilizes a **straight-fin design**. This is ideal for applications where there is a consistent, directional airflow. The fins increase the surface area available for heat transfer between the metal and the surrounding air. #### B. Push-Pin Mounting System Instead of using adhesive tape which can degrade over time, the `R0` designation indicates a push-pin attachment system: * **Compression Springs:** Provide precise vertical pressure to ensure maximum contact with the component. * **Plastic/Brass Pins:** Designed to snap into pre-drilled holes on a PCB (Printed Circuit Board). #### C. Thermal Interface Material (TIM) The unit comes "pre-applied" with **T766 thermal grease**. This fills microscopic air gaps between the heat sink base and the electronic chip, significantly reducing thermal resistance. #### D. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly improves radiant heat emission. --- ### 3. Thermal Performance Metrics Thermal resistance (measured in °C/W) determines how effectively the part cools. Lower values represent better cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 18.11 | | 300 (1.5 m/s) | 8.22 | | 500 (2.5 m/s) | 6.35 | | 700 (3.5 m/s) | 5.37 | --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Networking switches and routers. * **Power Electronics:** Voltage regulators and high-speed memory modules.