The **ATS-05F-201-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions** | 50.00mm x 50.00mm x 12.00mm | | **Thermal Resistance** | 8.17°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | | **Compression Spring** | High-performance brass/plastic | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the component's features: - **ATS**: Advanced Thermal Solutions (Manufacturer). - **05**: Series designation (Push-Pin attachment). - **F**: Fin pitch/density indicator. - **201**: Specific footprint and geometry identifier. - **C2**: Material and finish code (**Blue Anodized Aluminum**). - **R0**: Revision or RoHS compliance status. --- ### 3. Key Electronic Components Features The ATS-05F-201-C2-R0 is engineered with several electronic cooling priorities in mind: #### A. Thermal Interface Material (TIM) This model typically comes pre-applied with **ATS-PPS-05**, a high-performance thermal phase-change material. This ensures that there are no air gaps between the semiconductor (heat source) and the aluminum base, maximizing heat transfer. #### B. Push-Pin Mounting Unlike adhesive-based heat sinks, the push-pin mechanism provides: - **Consistent Pressure:** Ensuring the thermal interface remains effective over time. - **Vibration Resistance:** Securely holds the heat sink in place during industrial use. - **Ease of Installation:** Pre-drilled holes in the PCB allow for quick assembly. #### C. Straight Fin Design The straight fin geometry is optimized for **forced-air cooling**. In systems with active fans, the air flows through these channels to dissipate heat rapidly into the ambient environment. --- ### 4. Common Applications - **Semiconductors:** Cooling BGA (Ball Grid Array) packages. - **Telecommunications:** Used in routers and switches. - **Embedded Systems:** Thermal management for industrial motherboards.