ATS-05F-203-C2-R0
AI

The **ATS-05F-203-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "push-pin" series designed for cooling semiconductor devices like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Part Number** | ATS-05F-203-C2-R0 |
| **Type** | Board Level Heat Sink (Passive Cooling) |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | ~8.93°C/W (at 100 LFM) |
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### 2. Physical Dimensions
Effective heat dissipation depends heavily on surface area and geometry. Here are the physical specs:
* **Footprint (Size):** 54mm x 54mm
* **Height:** 10mm (Low profile)
* **Fin Style:** XCUT (Cross-cut fins allow for multi-directional airflow).
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### 3. Key Electronic/Thermal Features
#### A. Thermal Interface Material (TIM)
The suffix **"C2"** indicates that this part comes pre-applied with **T766 Phase Change Material**. This is critical for electronic stability as it fills the microscopic gaps between the heat sink and the electronic chip, ensuring maximum heat transfer.
#### B. Push-Pin Attachment
Instead of using adhesive tape (which can fail under high heat), this part uses a mechanical push-pin system. This provides:
* **Consistent Pressure:** Ensures the TIM is compressed evenly.
* **Vibration Resistance:** Securely holds the sink in place during industrial or automotive use.
#### C. Airflow Optimization
The "XCUT" fin design is particularly useful in dense electronic enclosures where the direction of the cooling fan's airflow might be unpredictable. The gaps between fins allow air to enter and exit from multiple angles.
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### 4. Common Applications
* **FPGA Cooling:** Used on high-gate-count field programmable gate arrays.
* **Networking Equipment:** Routers, switches, and base stations.
* **Embedded Systems:** Industrial PCs where vertical clearance (10mm height) is limited.
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What is the difference between Blue Anodized and Black Anodized finishes in heat sinks?
- ⤷ How do I calculate if the 8.93°C/W thermal resistance is sufficient for my chip?
- ⤷ Can the push-pin springs be customized for different PCB thicknesses?