The **ATS-05F-208-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 10.50°C/W (Unducted Flow @ 100 LFM) | | **Weight** | ~40.5 Grams | --- ### 2. Physical Dimensions Precision is critical for board layout and component clearance. * **Length (A):** 70.00 mm * **Width (B):** 70.00 mm * **Height (C):** 6.00 mm (Ultra-low profile) * **Pitch (E):** 63.00 mm (Distance between mounting holes) --- ### 3. Key Electronic/Mechanical Features #### A. Fin Design (Cross-Cut) The unit features a **straight fin** or **cross-cut** pattern. This increases the surface area for heat transfer while allowing multi-directional airflow, making it effective even if the cooling fan isn't perfectly aligned. #### B. Push-Pin Mounting Instead of using messy thermal adhesives or complex screws, this part uses a **push-pin and spring mechanism**. * **Benefits:** Provides consistent pressure on the electronic component, which optimizes the **Thermal Interface Material (TIM)** performance. * **Reliability:** The spring-loaded assembly prevents mechanical stress on the PCB during thermal expansion. #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the part comes with **no pre-applied thermal tape** or specific custom requirements, allowing engineers to choose their own high-performance thermal paste or pads based on the specific power density of the chip. --- ### 4. Application Scenarios This specific part is used in environments where vertical space is extremely limited: 1. **1U Rack Servers:** Where the low 6mm height is necessary for airflow clearance. 2. **Embedded Systems:** Industrial PCs where vibration resistance (via push-pins) is required. 3. **Telecommunications:** Cooling of ASICs and FPGAs on dense line cards. ---