The **ATS-05F-29-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. ### 1. General Specifications This part is manufactured by **Advanced Thermal Solutions (ATS)** as part of their "push pin" attachment series. | Feature | Specification | | :--- | :--- | | **Component Type** | Passive Heatsink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 7.66°C/W (at 100 LFM) | | **Weight** | ~40 grams | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and component clearance. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 20.00 mm (Profile) * **Fin Style:** Straight Fin (optimized for airflow) --- ### 3. Key Electronic/Thermal Features #### A. Thermal Resistance Flow The performance of the heatsink depends on the Airflow (Linear Feet per Minute - LFM). As airflow increases, the thermal resistance decreases: 1. **Unducted Flow:** 7.66°C/W @ 100 LFM 2. **Ducted Flow:** 1.62°C/W @ 500 LFM #### B. Push-Pin Attachment System The "05F" and "R0" designations refer to the specific mounting hardware. This model uses a **plastic push-pin** with a **brass spring**. * **Hole Pattern:** Standard 2-hole mounting. * **Pressure:** Consistent force ensures the thermal interface material (TIM) makes perfect contact with the heat-generating component. #### C. Pre-applied Thermal Interface Material (TIM) The part comes with **T766** thermal grease pre-applied to the base. This simplifies the assembly process and ensures optimal heat transfer from the chip to the aluminum fins. --- ### 4. Typical Applications This heatsink is commonly used for: * **CPUs/GPUs:** Small form factor processors. * **ASICs/FPGAs:** High-speed networking chips or industrial controllers. * **Power Supplies:** Cooling power MOSFETs or voltage regulators.