ATS-05F-30-C3-R0
AI

The **ATS-05F-30-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs.
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm |
| **Fin Style** | Straight |
| **Thermal Resistance** | 5.39°C/W (at 200 LFM) |
| **TIM (Thermal Interface Material)** | T412 (High performance) |
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### 2. Physical Design and Functionality
The part is composed of several critical elements that work together to manage heat:
* **Heat Sink Body:** Constructed from aluminum for a balance of lightweight properties and high thermal conductivity. The "30" in the part number indicates the base size or specific series dimensions.
* **Fin Geometry:** It features a "Fine Pitch" or "Straight Fin" design. This maximizes the surface area exposed to airflow, which is critical for convective cooling.
* **Blue Anodized Finish:** The coating is not just for aesthetics; it provides corrosion resistance and slightly improves radiative heat transfer.
* **Push-Pin Attachment:** Unlike adhesive tapes, the push-pin mechanism uses a pre-drilled hole in the PCB and a spring-loaded pin to provide consistent pressure. This ensures the heat sink remains in firm contact with the component during vibrations or thermal expansion.
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### 3. Thermal Performance Profile
The efficiency of this part is highly dependent on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **200 (1.0 m/s)** | 5.39 |
| **400 (2.0 m/s)** | 3.10 |
| **600 (3.0 m/s)** | 2.50 |
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### 4. Part Number Breakdown (Suffix Meaning)
* **-C3:** Typically refers to the thermal interface material (TIM) or the specific hardware/spring tension kit included.
* **-R0:** Indicates the revision or RoHS compliance status (standard lead-free).
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How do I calculate if the 5.39°C/W thermal resistance is sufficient for my specific chip?
- ⤷ What are the PCB hole requirements for the push-pin mounting system?
- ⤷ What is the difference between the T412 TIM and other thermal pads used in this series?