The **ATS-05F-33-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for cooling integrated circuits (ICs) like CPUs, GPUs, or BGA components. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics: | Property | Value/Description | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic Pins with Springs) | | **Thermal Resistance** | 17.50°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 35mm x 35mm | | **Height (Height Off Base)** | 20mm | | **Weight** | ~14 grams | | **Thermal Interface Material (TIM)** | T412 (High performance) | --- ### 2. Design and Component Breakdown #### **A. Fin Design (Straight Fin)** The "33" in the part number indicates the specific fin pattern. This model uses a **straight fin** configuration, which is ideal for systems where airflow is predictable and flows in a single direction. #### **B. Attachment Mechanism (pushPIN™)** Instead of using messy adhesives or permanent solder, this part uses a mechanical fastening system: * **Plastic Pins:** Inserted through pre-drilled holes in the PCB. * **Springs:** Provide constant, uniform pressure (compression) on the chip to ensure maximum thermal transfer. #### **C. Thermal Interface Material (T412)** The base of the heat sink comes pre-applied with **T412 thermal grease**. This fills the microscopic air gaps between the chip surface and the aluminum base, significantly reducing thermal resistance. --- ### 3. Usage Context This part is typically found in: * **Telecommunications:** Cooling network switches or routers. * **Embedded Systems:** Industrial PCs where space is limited but cooling is critical. * **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators. ---