The **ATS-05F-36-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for cooling processors and other high-heat integrated circuits. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W)** | 36.83 mm x 36.83 mm | | **Height (Fin Height)** | 12.70 mm | | **Thermal Resistance** | 14.90 °C/W (at 1.0 m/s airflow) | | **Fin Pattern** | Fine Pitch (Rectangular) | --- ### 2. Design and Engineering Features * **High-Efficiency Fin Design:** The "fine pitch" design maximizes the surface area within a small footprint, allowing for better heat dissipation in systems with forced-air cooling (fans). * **Blue Anodized Finish:** The anodized coating is not just for aesthetics; it increases the surface emissivity, providing slightly better radiation cooling and protecting the aluminum from corrosion. * **Push-Pin Attachment:** The part includes a pre-assembled push-pin and spring mechanism. This ensures: 1. **Consistent Pressure:** The spring provides a specific "load" or force, ensuring the heat sink stays in firm contact with the chip. 2. **Ease of Assembly:** No screws or tools are typically required for mounting on a PCB with pre-drilled holes. --- ### 3. Thermal Interface Material (TIM) The **-R0** suffix usually indicates the specific configuration of the Thermal Interface Material. For this model: * It typically comes with a pre-applied **Phase Change Material (PCM)** or high-performance thermal pad. * This eliminates the need for manual application of thermal grease, reducing assembly time and ensuring a uniform layer for heat transfer. --- ### 4. Typical Applications This heat sink is commonly found in: * **Networking Hardware:** Routers, switches, and modems. * **Industrial PCs:** Compact motherboards where space is limited. * **Embedded Systems:** Cooling FPGAs, ASICs, and small CPUs. ---