The **ATS-05F-38-C3-R0** is a high-performance thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Dimensions (L x W)** | 36.83 mm x 36.83 mm | | **Height** | 27.94 mm | | **Pitch** | Fine Pitch (High density fins) | | **Thermal Resistance** | 0.90°C/W (at 200 LFM) | --- ### 2. Key Component Features #### A. Fin Design (Fine Pitch) The "F" in the part number indicates a **Fine Pitch** fin pattern. This design maximizes the surface area within a small footprint, making it ideal for high-velocity airflow environments where heat needs to be dissipated rapidly. #### B. pushPIN™ Attachment Unlike adhesive tapes or simple clips, this part uses a mechanical push-pin system: * **Compression Springs:** Provide precise pressure to ensure optimal thermal interface material (TIM) contact. * **Secure Mounting:** Prevents the heat sink from shifting due to vibration or thermal expansion. #### C. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Provides corrosion resistance and increases emissivity for better radiant heat transfer. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying the specific configuration: * **ATS:** Manufacturer (Advanced Thermal Solutions) * **05:** Series/Style * **F:** Fin Pitch (Fine) * **38:** Dimension Code (Approx. 37-38mm) * **C3:** Performance/Material combination * **R0:** Revision code --- ### 4. Application Use Cases This heat sink is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Cooling MOSFETs or IGBTs in power supplies.