The **ATS-05F-45-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or power transistors. --- ### ## Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 15.02 °C/W (at 100 LFM) to 1.51 °C/W (at 700 LFM) | | **Fin Style** | Straight Fin | | **Dimensions** | 25mm x 25mm x 20mm | | **Mounting Hole Pattern** | 30mm x 30mm | | **Compatibility** | Pre-assembled with 45mm springs | --- ### ## Key Electronic & Mechanical Parts #### 1. The Heat Sink Body (Straight Fin) The body is constructed from high-grade aluminum. The **Straight Fin** design is optimized for environments where the airflow is consistent and unidirectional. The "20mm" height provides a significant surface area for heat dissipation relative to its small footprint. #### 2. The pushPIN™ Attachment System Instead of using adhesive tapes or simple clips, this part uses a **pushPIN™** system. * **The Pin:** A plastic or brass pin that snaps into the PCB. * **The Spring:** The "45" in the part number indicates the spring size/tension. This ensures high interface pressure for maximum thermal transfer between the component and the heat sink. #### 3. Thermal Interface Material (TIM) The **-R0** designation typically indicates that the part comes with a pre-applied high-performance **Thermal Interface Material**. This fills the microscopic air gaps between the electronic component (like a microprocessor) and the aluminum base of the heat sink to ensure efficient heat flow. --- ### ## Thermal Performance Overview Electronic components vary in temperature based on the airflow (LFM - Linear Feet per Minute). * **Low Airflow (100 LFM):** Heat dissipation is less efficient (15.02 °C/W). * **High Airflow (700 LFM):** Heat dissipation is highly efficient (1.51 °C/W). --- ### ## Application Use Cases * **Embedded Systems:** Cooling small-form-factor processors. * **Telecommunications:** Cooling signal processing chips on PCBs. * **Power Supplies:** Managing heat for voltage regulators.