ATS-05F-46-C3-R0
AI

## Technical Overview: ATS-05F-46-C3-R0
The **ATS-05F-46-C3-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** Heat Sink series, designed for cooling integrated circuits (ICs) and other electronic components.
### 1. Key Specifications
| Feature | Specification |
| :--- | :--- |
| **Component Type** | Heat Sink (Thermal Management) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | 11.87 °C/W (at 100 LFM) |
| **Dimensions** | 25mm x 25mm x 25mm |
| **Thermal Interface Material** | T412 (Pre-applied) |
---
### 2. Design and Engineering Features
* **Fine Pitch Fin Design:** The "F" in the part number indicates a **Fine Pitch** fin pattern. This increases the surface area for heat dissipation, making it highly efficient for high-velocity airflow environments.
* **pushPIN™ Attachment:** Instead of messy adhesives or fragile clips, this part uses a spring-loaded pin mechanism. This ensures:
* **Consistent Pressure:** Even contact across the CPU/GPU/Chipset surface.
* **Security:** High vibration resistance for industrial or mobile applications.
* **Ease of Assembly:** Quick installation with pre-drilled holes in the PCB.
* **Blue Anodized Coating:** This is not just for aesthetics; the anodization increases the surface emissivity, slightly improving radiative heat transfer and providing corrosion resistance.
---
### 3. Part Number Breakdown
Understanding the nomenclature helps in identifying its specific characteristics:
| Code Segment | Meaning |
| :--- | :--- |
| **ATS-05** | Series identification |
| **F** | Fine Pitch (Fin configuration) |
| **46** | Specific design/thermal profile code |
| **C3** | Thermal Interface Material (T412) and color code |
| **R0** | Revision/Standard version |
---
### 4. Thermal Performance Data
Performance varies based on airflow (measured in Linear Feet per Minute - LFM):
* **@100 LFM (0.5 m/s):** 11.87 °C/W
* **@200 LFM (1.0 m/s):** 4.02 °C/W
* **@500 LFM (2.5 m/s):** 2.13 °C/W
*Note: Lower °C/W values indicate better cooling efficiency as airflow increases.*
- ⤷
What are the PCB hole requirements for the pushPIN attachment?
- ⤷ How does the T412 thermal interface material compare to standard thermal paste?
- ⤷ Is this heat sink compatible with standard 25mm cooling fans?