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  • ATS-05F-46-C3-R0

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    ## Technical Overview: ATS-05F-46-C3-R0 The **ATS-05F-46-C3-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** Heat Sink series, designed for cooling integrated circuits (ICs) and other electronic components. ### 1. Key Specifications | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Thermal Management) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 11.87 °C/W (at 100 LFM) | | **Dimensions** | 25mm x 25mm x 25mm | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Design and Engineering Features * **Fine Pitch Fin Design:** The "F" in the part number indicates a **Fine Pitch** fin pattern. This increases the surface area for heat dissipation, making it highly efficient for high-velocity airflow environments. * **pushPIN™ Attachment:** Instead of messy adhesives or fragile clips, this part uses a spring-loaded pin mechanism. This ensures: * **Consistent Pressure:** Even contact across the CPU/GPU/Chipset surface. * **Security:** High vibration resistance for industrial or mobile applications. * **Ease of Assembly:** Quick installation with pre-drilled holes in the PCB. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization increases the surface emissivity, slightly improving radiative heat transfer and providing corrosion resistance. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying its specific characteristics: | Code Segment | Meaning | | :--- | :--- | | **ATS-05** | Series identification | | **F** | Fine Pitch (Fin configuration) | | **46** | Specific design/thermal profile code | | **C3** | Thermal Interface Material (T412) and color code | | **R0** | Revision/Standard version | --- ### 4. Thermal Performance Data Performance varies based on airflow (measured in Linear Feet per Minute - LFM): * **@100 LFM (0.5 m/s):** 11.87 °C/W * **@200 LFM (1.0 m/s):** 4.02 °C/W * **@500 LFM (2.5 m/s):** 2.13 °C/W *Note: Lower °C/W values indicate better cooling efficiency as airflow increases.*
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN attachment?
    • ⤷ How does the T412 thermal interface material compare to standard thermal paste?
    • ⤷ Is this heat sink compatible with standard 25mm cooling fans?