ATS-05F-49-C3-R0
AI

The **ATS-05F-49-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or damage.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | push-PIN™ |
| **Thermal Resistance** | 26.55°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions (L x W x H)** | 30mm x 30mm x 20mm |
| **Fin Pattern** | Fine Pitch (Rectangular) |
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### 2. Key Components & Design
The "electronic" functionality of this part is passive, focusing on heat transfer through conduction and convection:
* **Push-Pin Attachment:** This model uses a spring-loaded push-pin system. This ensures a consistent pressure (compression) on the electronic chip, which is critical for maintaining an effective thermal interface between the chip surface and the sink.
* **Thermal Interface Material (TIM):** Usually, these units come with **T412** or similar pre-applied thermal tape/grease. This material fills microscopic air gaps between the component and the heat sink.
* **Fin Geometry:** The "Fine Pitch" design increases the surface area significantly within a small 30x30mm footprint, allowing for better heat dissipation in forced-air environments (fans).
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### 3. Application Use Cases
This specific heat sink is typically found in the following electronic assemblies:
1. **Telecommunications:** High-speed routers and switches.
2. **Embedded Computing:** Industrial PC boards where space is constrained.
3. **Power Supplies:** Cooling MOSFETs or voltage regulators.
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### 4. Thermal Performance Data
Performance varies based on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure:
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 26.55 |
| 300 | 1.5 | 9.29 |
| 500 | 2.5 | 6.03 |
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What is the difference between the C1
- ⤷ C2
- ⤷ and C3 suffixes in ATS part numbers?
- ⤷ How do I calculate if this heat sink is sufficient for a 10W component?
- ⤷ Are there alternative attachment methods for this specific heat sink size?