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  • ATS-05F-49-C3-R0

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    The **ATS-05F-49-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or damage. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | push-PIN™ | | **Thermal Resistance** | 26.55°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 30mm x 30mm x 20mm | | **Fin Pattern** | Fine Pitch (Rectangular) | --- ### 2. Key Components & Design The "electronic" functionality of this part is passive, focusing on heat transfer through conduction and convection: * **Push-Pin Attachment:** This model uses a spring-loaded push-pin system. This ensures a consistent pressure (compression) on the electronic chip, which is critical for maintaining an effective thermal interface between the chip surface and the sink. * **Thermal Interface Material (TIM):** Usually, these units come with **T412** or similar pre-applied thermal tape/grease. This material fills microscopic air gaps between the component and the heat sink. * **Fin Geometry:** The "Fine Pitch" design increases the surface area significantly within a small 30x30mm footprint, allowing for better heat dissipation in forced-air environments (fans). --- ### 3. Application Use Cases This specific heat sink is typically found in the following electronic assemblies: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Computing:** Industrial PC boards where space is constrained. 3. **Power Supplies:** Cooling MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data Performance varies based on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 26.55 | | 300 | 1.5 | 9.29 | | 500 | 2.5 | 6.03 |
    ✨ Follow-up Questions
    • ⤷ What is the difference between the C1
    • ⤷ C2
    • ⤷ and C3 suffixes in ATS part numbers?
    • ⤷ How do I calculate if this heat sink is sufficient for a 10W component?
    • ⤷ Are there alternative attachment methods for this specific heat sink size?