The **ATS-05F-52-C3-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" attachment series designed to provide efficient cooling for electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 35mm x 35mm x 25mm | | **Fin Style** | Straight (Vertical) | | **Attachment Type** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 1.15°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. Heat Sink Geometry * **Fin Configuration:** It utilizes a **cross-cut** or high-density fin pattern which increases the surface area for heat dissipation. * **Thermal Efficiency:** The 25mm height is optimized for systems with moderate vertical clearance while providing significant cooling capacity compared to low-profile sinks. #### B. Attachment Mechanism (Push-Pin) * The part uses a **Brass Push-Pin** with a **Compression Spring**. * This provides a consistent, high-pressure contact between the heat sink and the electronic chip, ensuring minimal air gaps. * The industry-standard hole pattern allows for easy installation on PCBs without the need for specialized tools. #### C. Thermal Interface Material (TIM) * The "C3" in the part number indicates it comes with **T766** thermal grease pre-applied to the base. * This ensures optimal heat transfer from the component to the aluminum body immediately upon installation. --- ### 3. Application Use-Cases This specific heat sink is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed networking processors. 2. **Industrial Controls:** Managing heat in power-dense modules. 3. **Embedded Systems:** Providing thermal relief for SOCs (System on Chips) in compact enclosures. ---