The **ATS-05F-55-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number itself contains specific engineering data regarding its dimensions, material, and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 23.98°C/W (at 100 LFM) | | **Dimensions** | 35.00mm x 35.00mm | | **Height** | 10.00mm | | **Attachment Method** | Push-Pin (Plastic) | --- ### 2. Key Design Elements #### A. Fin Pattern (Cross-Cut) The "55" in the part number often refers to a specific fin configuration. This model typically uses a **Cross-Cut** pattern. Unlike straight fins, cross-cut fins allow for multi-directional airflow, making the heat sink effective even if the air isn't blowing in a single straight line. #### B. Attachment Mechanism: pushPIN™ This part utilizes a spring-loaded push-pin system. - **Efficiency:** Provides precise, uniform pressure across the component (TIM - Thermal Interface Material). - **Security:** Ensures the heat sink remains in contact with the chip during vibrations or shipping. - **Hardware:** Usually includes a stainless steel or plastic pin with a high-performance compression spring. #### C. Thermal Interface Material (TIM) The "R0" suffix indicates the revision and packaging, often implying that the unit comes with a **pre-applied Thermal Interface Material** (like T766 or similar phase-change material). This eliminates the need for manual thermal paste application during assembly. --- ### 3. Applications This specific heat sink is categorized as a "Low Profile" solution (10mm height), making it ideal for: * **Networking Equipment:** Routers and switches with tight vertical clearance. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Power Supplies:** Cooling small MOSFETs or voltage regulators. ---