The **ATS-05F-71-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by Advanced Thermal Solutions (ATS). ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ HS | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Thermal Resistance (Flowing)** | 1.19 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 6.77 °C/W | | **Attachment Method** | Push-Pin (Spring Loaded) | | **TIM (Thermal Interface Material)** | T412 (Pre-applied) | --- ### 2. Key Design Features * **Fine Pitch Fin Design:** The "F" in the part number indicates a fine-pitch straight fin pattern. This increases the surface area for heat dissipation, making it ideal for high-velocity airflow environments. * **pushPIN™ Attachment:** Instead of messy adhesives or fragile clips, this part uses a standardized push-pin mechanism. This ensures constant pressure on the chip, improving thermal transfer. * **Pre-Applied TIM:** It comes with **T412** thermal interface material. This reduces assembly time and ensures a uniform layer of thermal paste between the heat source and the aluminum base. * **Blue Anodized Finish:** This treatment is not just aesthetic; it provides corrosion resistance and slightly improves radiative heat transfer. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code helps in identifying the exact variant: | Segment | Meaning | Detail | | :--- | :--- | :--- | | **ATS-05** | Series | Part of the pushPIN™ family | | **F** | Fin Type | Fine pitch | | **71** | Size Code | 45mm x 45mm footprint | | **C3** | Height/Color | 30.00mm height / Blue Anodized | | **R0** | Revision | Specific manufacturing revision | --- ### 4. Application Use Cases This heatsink is typically found in: 1. **Networking Hardware:** Switches, routers, and high-speed gateways. 2. **Power Electronics:** Cooling MOSFETs or power modules. 3. **Embedded Systems:** Industrial PCs and single-board computers where space is available for a 30mm tall cooler.