The **ATS-05F-88-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* It is designed for cooling electronic components such as CPUs, GPUs, or power transistors where space is limited but thermal dissipation is critical. --- ### 1. Technical Specifications The following table details the physical and thermal properties of this specific model: | Property | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-05F-88-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 35mm x 35mm x 25mm | | **Thermal Resistance** | 6.67°C/W (at 100 LFM) | | **Fin Style** | XCUT (Straight Fins) | --- ### 2. Key Design Features #### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a **pushPIN™** mechanism. This provides: * **Constant Pressure:** Ensures optimal thermal interface material (TIM) contact. * **Secure Mounting:** Prevents the heat sink from shifting during vibration or transport. * **Pre-drilled Holes:** Designed to fit standard PCB hole patterns. #### B. XCUT Fin Profile The "XCUT" geometry refers to the vertical straight fins. This design is optimized for: 1. **Airflow Efficiency:** Minimizes pressure drop across the heat sink. 2. **Surface Area:** Maximizes the area available for heat transfer to the surrounding air. #### C. Material & Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** Provides corrosion resistance and slightly improves radiative heat transfer. --- ### 3. Application Use Cases This part is commonly used in the following electronic sectors: * **Telecommunications:** Cooling of networking chips and high-speed switches. * **Embedded Systems:** Industrial PCs where fan noise must be minimized. * **Power Electronics:** Dissipating heat from Voltage Regulators and MOSFETs. --- ### 4. Thermal Performance Comparison (Approximate values based on airflow velocity) | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 6.67 | | 300 (Moderate) | 2.22 | | 500 (High) | 1.59 |