The **ATS-05F-91-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **push-pin** attachment series, designed to provide efficient cooling for integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 10mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 21.89° C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Brass, Plastic) | | **Interface Material** | T766 (Thermal Tape/Grease) | --- ### 2. Key Components & Construction #### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, which is favored in electronics for its high thermal conductivity and lightweight properties. The **Blue Anodized** coating provides corrosion resistance and increases surface emissivity, slightly improving heat radiation. #### B. Fin Design It uses a **Straight Fin** design. This is optimized for "undirected" airflow or environments where the air moves in a consistent path across the board. The low profile (10mm) makes it ideal for dense server racks or compact electronic enclosures. #### C. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the "91" series utilizes a **Push-Pin** system. * **Spring-Loaded:** Provides consistent pressure across the chip surface. * **Reliability:** Eliminates the risk of the heat sink falling off due to adhesive degradation over time. * **Attachment:** Requires pre-drilled holes in the Printed Circuit Board (PCB). --- ### 3. Thermal Performance Profile The effectiveness of the ATS-05F-91-C1-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 21.89 | | 300 (Moderate) | 8.13 | | 500 (High) | 5.82 | --- ### 4. Common Applications * **BGA (Ball Grid Array) Cooling:** Used for CPUs, GPUs, and FPGAs. * **Telecommunications:** Cooling of high-speed networking switches. * **Power Supplies:** Managing heat in voltage regulators and power converters.