The **ATS-05F-94-C2-R0** is a high-performance electronic thermal management component, specifically an aluminum heat sink designed for cooling integrated circuits (ICs) and other electronic components. ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height (Off Base)** | 20.00 mm | | **Thermal Resistance** | 14.63°C/W (at 100 LFM) to 1.05°C/W (at 700 LFM) | | **Finish** | Blue Anodized | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Elements #### A. Fin Pattern (Cross-Cut) The "94" designation indicates a specific fin geometry. This heat sink uses a **straight-fin or cross-cut design** that maximizes surface area. This allows for high airflow efficiency and heat dissipation in both natural and forced convection environments. #### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or fragile clips, this part uses a **Push-Pin** mechanism. * **Engagement:** It uses a flexible nylon pin and a stainless steel spring. * **Pressure:** The spring ensures constant, even pressure across the component, optimizing the thermal contact between the chip and the heat sink. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**, a high-performance thermal grease. This eliminates the need for manual application and ensures there are no air gaps between the heat sink and the electronic component (CPU, GPU, or FPGA). --- ### 3. Application Use-Cases This specific heat sink is typically found in: 1. **Telecommunications:** Networking switches and routers. 2. **Embedded Systems:** Industrial PCs and high-speed controllers. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. ---