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  • ATS-05F-96-C2-R0

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    The **ATS-05F-96-C2-R0** is a specific electronic component, categorized as a **High-Performance Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling integrated circuits (ICs) like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push Pin (Plastic) | | **Thermal Resistance** | 5.63°C/W (at 100 LFM) | | **Flow Direction** | Vertical (Cross-Cut) | | **Dimensions (L x W x H)** | 40mm x 40mm x 35mm | | **Fin Style** | Straight (Cross-Cut for multidirectional air) | --- ### 2. Design and Composition The ATS-05F-96-C2-R0 is engineered for maximum heat dissipation in constrained spaces. * **Cross-Cut Fin Pattern:** The fins are not continuous long strips; they are cut into a grid pattern. This allows the heat sink to be "omni-directional," meaning it can dissipate heat efficiently regardless of the direction of the airflow inside the chassis. * **Material Choice:** It uses aluminum, which provides a balance between lightweight design and high thermal conductivity. The **Blue Anodized** coating is not just for aesthetics; it increases surface emissivity and provides corrosion resistance. * **Attachment Mechanism:** The "C2" in the part number signifies the specific attachment kit. It uses a **Push Pin** mechanism with a spring, which ensures constant pressure between the heat sink and the chip to maximize thermal transfer. --- ### 3. Usage Requirements To function effectively, this part typically requires: 1. **Thermal Interface Material (TIM):** A thermal pad or paste must be applied between the base of the heat sink and the electronic component to eliminate air gaps. 2. **Mounting Holes:** The PCB (Printed Circuit Board) must have pre-drilled holes corresponding to the push pin spacing of this specific model. --- ### 4. Comparison to Similar Models | Feature | ATS-05F-96-C2-R0 | Standard Flat Heat Sink | | :--- | :--- | :--- | | **Airflow Sensitivity** | Low (Omni-directional) | High (Requires linear flow) | | **Mounting** | Mechanical Push Pin | Adhesive Tape / Epoxy | | **Performance** | High (35mm Height) | Low (Usually <15mm Height) |
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole spacing requirements for the C2 mounting style?
    • ⤷ How does the thermal resistance change at higher airflow (e.g.
    • ⤷ 500 LFM)?
    • ⤷ Is this heat sink compatible with pre-applied thermal interface materials (TIM)?