ATS-05F-96-C2-R0
AI

The **ATS-05F-96-C2-R0** is a specific electronic component, categorized as a **High-Performance Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling integrated circuits (ICs) like processors, FPGAs, and ASICs.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push Pin (Plastic) |
| **Thermal Resistance** | 5.63°C/W (at 100 LFM) |
| **Flow Direction** | Vertical (Cross-Cut) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 35mm |
| **Fin Style** | Straight (Cross-Cut for multidirectional air) |
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### 2. Design and Composition
The ATS-05F-96-C2-R0 is engineered for maximum heat dissipation in constrained spaces.
* **Cross-Cut Fin Pattern:** The fins are not continuous long strips; they are cut into a grid pattern. This allows the heat sink to be "omni-directional," meaning it can dissipate heat efficiently regardless of the direction of the airflow inside the chassis.
* **Material Choice:** It uses aluminum, which provides a balance between lightweight design and high thermal conductivity. The **Blue Anodized** coating is not just for aesthetics; it increases surface emissivity and provides corrosion resistance.
* **Attachment Mechanism:** The "C2" in the part number signifies the specific attachment kit. It uses a **Push Pin** mechanism with a spring, which ensures constant pressure between the heat sink and the chip to maximize thermal transfer.
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### 3. Usage Requirements
To function effectively, this part typically requires:
1. **Thermal Interface Material (TIM):** A thermal pad or paste must be applied between the base of the heat sink and the electronic component to eliminate air gaps.
2. **Mounting Holes:** The PCB (Printed Circuit Board) must have pre-drilled holes corresponding to the push pin spacing of this specific model.
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### 4. Comparison to Similar Models
| Feature | ATS-05F-96-C2-R0 | Standard Flat Heat Sink |
| :--- | :--- | :--- |
| **Airflow Sensitivity** | Low (Omni-directional) | High (Requires linear flow) |
| **Mounting** | Mechanical Push Pin | Adhesive Tape / Epoxy |
| **Performance** | High (35mm Height) | Low (Usually <15mm Height) |
- ⤷
What are the PCB hole spacing requirements for the C2 mounting style?
- ⤷ How does the thermal resistance change at higher airflow (e.g.
- ⤷ 500 LFM)?
- ⤷ Is this heat sink compatible with pre-applied thermal interface materials (TIM)?