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  • ATS-05F-97-C2-R0

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    The **ATS-05F-97-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure operational stability. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Thermal Resistance** | 20.30 °C/W (Unducted Flow @ 100 LFM) | | **Fin Type** | XCUT (Cross-cut for multi-directional airflow) | --- ### 2. Key Electronic Features #### A. pushPIN™ Attachment This part utilizes a specialized spring-loaded mechanism called **pushPIN™**. - **Benefit:** It ensures a precise and consistent pressure across the thermal interface material (TIM), preventing damage to delicate silicon dies while maximizing heat transfer. - **Hardware:** It typically comes with brass or plastic pins and stainless steel springs. #### B. XCUT Fin Design The "XCUT" geometry refers to a cross-cut pattern in the aluminum fins. - **Airflow Efficiency:** Unlike straight-fin heat sinks, XCUT designs allow air to enter and exit from multiple directions. This is ideal for systems where the airflow direction is inconsistent or crowded. #### C. Blue Anodized Finish The surface is treated with a blue anodized coating. - **Protection:** It protects the aluminum from corrosion and environmental wear. - **Radiation:** Anodization slightly improves the surface emissivity, aiding in heat dissipation via radiation. --- ### 3. Application Use Cases This specific heat sink is categorized as a "Low Profile" solution (10mm height), making it suitable for: * **1U Rack Servers:** Where vertical space is extremely limited. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Telecommunications:** High-speed routers and switches. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted thermal resistance for this part?
    • ⤷ Which Thermal Interface Material (TIM) is recommended for the ATS-05F-97-C2-R0?
    • ⤷ How do I calculate if the 10mm height is sufficient for my component's TDP?