ATS-05F-97-C2-R0
AI

The **ATS-05F-97-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure operational stability.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 10mm |
| **Thermal Resistance** | 20.30 °C/W (Unducted Flow @ 100 LFM) |
| **Fin Type** | XCUT (Cross-cut for multi-directional airflow) |
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### 2. Key Electronic Features
#### A. pushPIN™ Attachment
This part utilizes a specialized spring-loaded mechanism called **pushPIN™**.
- **Benefit:** It ensures a precise and consistent pressure across the thermal interface material (TIM), preventing damage to delicate silicon dies while maximizing heat transfer.
- **Hardware:** It typically comes with brass or plastic pins and stainless steel springs.
#### B. XCUT Fin Design
The "XCUT" geometry refers to a cross-cut pattern in the aluminum fins.
- **Airflow Efficiency:** Unlike straight-fin heat sinks, XCUT designs allow air to enter and exit from multiple directions. This is ideal for systems where the airflow direction is inconsistent or crowded.
#### C. Blue Anodized Finish
The surface is treated with a blue anodized coating.
- **Protection:** It protects the aluminum from corrosion and environmental wear.
- **Radiation:** Anodization slightly improves the surface emissivity, aiding in heat dissipation via radiation.
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### 3. Application Use Cases
This specific heat sink is categorized as a "Low Profile" solution (10mm height), making it suitable for:
* **1U Rack Servers:** Where vertical space is extremely limited.
* **Embedded Systems:** Industrial PCs and IoT gateways.
* **Telecommunications:** High-speed routers and switches.
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- ⤷
What is the difference between ducted and unducted thermal resistance for this part?
- ⤷ Which Thermal Interface Material (TIM) is recommended for the ATS-05F-97-C2-R0?
- ⤷ How do I calculate if the 10mm height is sufficient for my component's TDP?