The **ATS-05F-98-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs). --- ### 1. Technical Specifications The part is characterized by its physical dimensions and thermal resistance properties, which determine how effectively it can dissipate heat from a semiconductor device. | Property | Description / Value | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded attachment) | | **Thermal Resistance** | 15.31°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Fin Pattern** | Cross-Cut (Square-Fin) | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Key Electronic Features #### A. Cross-Cut Fin Design Unlike straight-fin heat sinks, the cross-cut (or square-fin) pattern allows for airflow from any direction (omnidirectional). This is critical in cramped electronic enclosures where air turbulence and direction can vary. #### B. pushPIN™ Attachment System This component uses a specialized mechanical attachment system consisting of: * **Brass/Plastic Push Pins:** Used to secure the heat sink to the PCB through pre-drilled holes. * **Stainless Steel Springs:** Provide consistent "Engagement Force," ensuring a reliable thermal interface between the heat sink base and the chip. #### C. Pre-applied Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with a pre-applied **Phase Change Material (PCM)** or high-performance thermal pad on the base. This eliminates the need for manual thermal paste application during assembly. --- ### 3. Applications in Electronics This specific size and thermal profile are commonly found in: 1. **Telecommunications:** Cooling Network Interface Cards (NICs) or small switches. 2. **Embedded Systems:** Dissipating heat from FPGAs or Microprocessors. 3. **Power Supplies:** Cooling voltage regulators or power transistors. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Res (°C/W)** | 15.31 | 5.81 | 3.67 |