ATS-05G-101-C3-R0
AI

The **ATS-05G-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure system stability.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics:
| Property | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 6.77°C/W (at 100 LFM) |
| **Dimensions** | 45mm x 45mm x 30mm |
| **Fin Style** | Fine Pitch (straight fins) |
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### 2. Key Design Features
#### A. pushPIN™ Attachment System
Unlike adhesive tapes or simple clips, this part uses a **pushPIN™** system.
* **Benefits:** Ensures precise pressure on the component (TIM - Thermal Interface Material), which optimizes heat transfer.
* **Hardware:** Includes a brass or plastic pin with a stainless steel spring to provide reliable compression.
#### B. High-Performance Fin Design
The "05G" series utilizes a "Fine Pitch" geometry.
* This increases the total surface area available for heat exchange.
* It is optimized for **forced air cooling** (environments with fans) rather than passive cooling.
#### C. Thermal Interface Material (TIM)
The "C3" designation typically indicates that the heat sink comes pre-applied with **ATS-PPS-05** or a similar high-performance thermal grease, reducing assembly time and ensuring uniform coverage.
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### 3. Applications
This specific heat sink is commonly found in the following electronic sectors:
1. **Telecommunications:** Cooling of high-speed networking chips and routers.
2. **Embedded Computing:** Industrial PC processors and FPGA modules.
3. **Power Electronics:** Dissipating heat from high-wattage power supplies or motor controllers.
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### 4. Dimensional Diagram Reference
```text
45mm (L)
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| | 30mm (H)
```
- ⤷
What is the difference between Blue Anodized and Black Anodized finishes in thermal performance?
- ⤷ How does the LFM (Linear Feet per Minute) airflow affect the thermal resistance of this part?
- ⤷ Can the pushPIN hardware be customized for different PCB thicknesses?