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  • ATS-05G-101-C3-R0

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    The **ATS-05G-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure system stability. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.77°C/W (at 100 LFM) | | **Dimensions** | 45mm x 45mm x 30mm | | **Fin Style** | Fine Pitch (straight fins) | --- ### 2. Key Design Features #### A. pushPIN™ Attachment System Unlike adhesive tapes or simple clips, this part uses a **pushPIN™** system. * **Benefits:** Ensures precise pressure on the component (TIM - Thermal Interface Material), which optimizes heat transfer. * **Hardware:** Includes a brass or plastic pin with a stainless steel spring to provide reliable compression. #### B. High-Performance Fin Design The "05G" series utilizes a "Fine Pitch" geometry. * This increases the total surface area available for heat exchange. * It is optimized for **forced air cooling** (environments with fans) rather than passive cooling. #### C. Thermal Interface Material (TIM) The "C3" designation typically indicates that the heat sink comes pre-applied with **ATS-PPS-05** or a similar high-performance thermal grease, reducing assembly time and ensuring uniform coverage. --- ### 3. Applications This specific heat sink is commonly found in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed networking chips and routers. 2. **Embedded Computing:** Industrial PC processors and FPGA modules. 3. **Power Electronics:** Dissipating heat from high-wattage power supplies or motor controllers. --- ### 4. Dimensional Diagram Reference ```text 45mm (L) _________________ | ||||||||||||||| | | ||||||||||||||| | 45mm (W) | ||||||||||||||| | |_________________| | | 30mm (H) ```
    ✨ Follow-up Questions
    • ⤷ What is the difference between Blue Anodized and Black Anodized finishes in thermal performance?
    • ⤷ How does the LFM (Linear Feet per Minute) airflow affect the thermal resistance of this part?
    • ⤷ Can the pushPIN hardware be customized for different PCB thicknesses?