## Electronic Specifications: ATS-05G-35-C2-R0 The **ATS-05G-35-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for cooling electronic components like CPUs, GPUs, and power transistors. ### 1. General Specifications Below are the physical and material properties of the heat sink: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Thermal Resistance Performance Thermal resistance ($\text{°C/W}$) determines how efficiently the heat sink dissipates heat at various airflow speeds (measured in Linear Feet per Minute - LFM). | Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | 700 (3.5 m/s) | | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow** | 22.48 °C/W | 10.34 °C/W | 5.80 °C/W | 4.09 °C/W | | **Ducted Flow** | 4.34 °C/W | 2.74 °C/W | 2.22 °C/W | 1.96 °C/W | --- ### 3. Dimensional Data Precise sizing is critical for PCB layout and avoiding interference with surrounding electronic components. | Dimension | Value (mm) | | :--- | :--- | | **Width (A)** | 35.00 mm | | **Length (B)** | 35.00 mm | | **Height (C)** | 10.00 mm | | **Pitch (E)** | 40.00 mm | | **Pitch (F)** | 40.00 mm | --- ### 4. Key Electronic Applications * **Integrated Circuits (ICs):** Used on BGA (Ball Grid Array) packages for processors. * **Voltage Regulators:** Cooling VRMs on motherboards. * **Telecommunications:** Cooling chips in routers and high-speed switches. * **Embedded Systems:** Industrial PCs where space is limited but high thermal conductivity is required. --- ### 5. Technical Design Features * **Fine Pitch Fin Design:** The "XC" pattern features straight fins that provide a large surface area for heat exchange relative to the small footprint. * **Push-Pin Attachment:** Provides a secure, vibration-resistant mount with specific spring-loaded tension to ensure optimal contact with the die. * **Pre-applied TIM:** The T766 thermal interface material ensures low contact resistance between the electronic component and the aluminum base without requiring manual paste application.