The **ATS-05G-71-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 6.69°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Pattern** | Straight Fin | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the component's features: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **05**: Refers to the series or specific tooling. * **G**: Indicates the material/fin type (typically Aluminum). * **71**: Sequential identification for specific dimensions (45x45x20mm). * **C2**: Thermal Interface Material (TIM) code; "C2" usually refers to **T766** high-performance thermal grease pre-applied to the base. * **R0**: RoHS compliance status. --- ### 3. Key Electronic Functions While the heat sink itself is passive (it does not consume electricity), its role in an electronic circuit is critical: * **Thermal Dissipation**: It increases the surface area of the heat-generating component, allowing airflow (convection) to carry away heat more efficiently. * **Push-Pin Mounting**: The "Push-Pin" system utilizes pre-drilled holes in the PCB. This provides a consistent downward pressure (clamping force), ensuring the Thermal Interface Material (TIM) fills all microscopic air gaps between the chip and the heat sink. * **Thermal Interface Material (C2)**: The pre-applied T766 grease ensures low thermal resistance at the contact point, preventing "hot spots" that could damage sensitive silicon. --- ### 4. Application Use Cases This specific heat sink is commonly found in: 1. **Telecommunications**: Cooling network switches and routers. 2. **Embedded Computing**: Industrial motherboards where high vibration resistance is needed (provided by the push-pin/spring mechanism). 3. **Power Electronics**: Cooling high-speed voltage regulators.