The **ATS-05G-77-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. Produced by **Advanced Thermal Solutions (ATS)**, this specific part belongs to their *pushPIN™* series, which is engineered for secure attachment and efficient heat dissipation. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of the device: | Property | Value / Description | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic or Brass pegs with springs) | | **Dimensions (L x W)** | 25.0 mm x 25.0 mm | | **Height** | 20.0 mm | | **Pitch** | Fine Pitch (Designed for high airflow) | | **Thermal Resistance** | 9.30 °C/W (at 100 LFM) | | **Thermal Interface (TIM)** | T766 (Pre-applied thermal grease) | --- ### 2. Key Design Components #### A. Fin Geometry (Fine-Pitch) The part utilizes a **Fine-Pitch** fin design. This increases the total surface area available for heat transfer. It is ideal for systems where there is high-velocity airflow, as it maximizes the contact between the air and the aluminum structure. #### B. pushPIN™ Attachment Mechanism Unlike adhesive tapes that can fail over time or under high heat, this part uses a mechanical fastening system: * **Spring-loaded bolts/pegs:** Ensure consistent pressure (clamping force) against the component. * **Reliability:** Provides better stability during mechanical shock or vibration. #### C. Blue Anodized Finish The surface is treated with a blue anodized coating. While primarily used for aesthetic identification and corrosion resistance, anodization also slightly increases surface emissivity, aiding in radiative heat transfer. --- ### 3. Application Use Cases This heatsink is typically found in space-constrained electronic environments, such as: 1. **Telecommunications:** Cooling small processors in routers or switches. 2. **Embedded Systems:** Protecting SoCs (System on Chips) in industrial computers. 3. **Power Electronics:** Managing heat for voltage regulators or high-speed transistors. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 9.30 | | 300 (1.5 m/s) | 4.49 | | 500 (2.5 m/s) | 3.24 |