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  • ATS-05H-147-C2-R0

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    The part number **ATS-05H-147-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "blue ICE" series, designed specifically for cooling electronic components like CPUs, GPUs, and FPGAs. ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Straight Fin | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Thermal Resistance** | 13.52 °C/W (at 100 LFM) | | **Airflow Path** | Horizontal (High-performance flow) | --- ### 2. Electronic Component Breakdown #### A. Thermal Management Role This part is a **passive cooling component**. Its primary function is to increase the surface area of an integrated circuit (IC) to dissipate heat more efficiently into the surrounding air. In electronics, keeping the junction temperature low prevents "thermal throttling" and extends the lifespan of the silicon. #### B. Mounting Mechanism (pushPIN™) The "C2" in the part number signifies the attachment type. This heat sink uses a **push-pin with a brass/plastic compression spring**. * **Purpose:** It ensures consistent pressure on the processor, improving the contact between the chip and the heat sink. * **Assembly:** It requires pre-drilled holes on the Printed Circuit Board (PCB). #### C. Material and Finish * **Aluminum:** Chosen for its balance between thermal conductivity and weight. * **Blue Anodized:** The coating isn't just for aesthetics; anodizing increases the emissivity of the surface, slightly improving radiant heat transfer and protecting the aluminum from corrosion. --- ### 3. Applications This specific size (30x30mm) is commonly found in: * **Networking Equipment:** Routers, switches, and modems. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Power Supplies:** Cooling MOSFETs or voltage regulators. --- ### 4. Thermal Performance Comparison The effectiveness of this heat sink depends heavily on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Static/Natural) | 13.52 | | 300 (Moderate Fan) | 6.43 | | 500 (High-Speed Fan) | 4.73 |
    ✨ Follow-up Questions
    • ⤷ What is the difference between push-pin and thermal adhesive mounting for this part?
    • ⤷ How do I calculate if this heat sink is sufficient for my chip's TDP?
    • ⤷ Are there copper versions of the ATS-147 series available?