The **ATS-05H-182-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, or power transistors. --- ## 1. Technical Specifications The part number defines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Heat Sink Type** | Push-pin Heat Sink | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 15mm | | **Pitch (Spacing)** | 45mm x 45mm | | **Fin Pattern** | Straight Fin | | **Attachment Method** | Push-Pin (Spring-loaded) | --- ## 2. Thermal Performance Data Thermal resistance is measured in °C/W (Degrees Celsius per Watt). Lower values indicate better cooling efficiency. | Airflow Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | 700 (3.5 m/s) | | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow (°C/W)** | 7.51 | 3.98 | 3.08 | 2.63 | | **Ducted Flow (°C/W)** | 3.70 | 2.63 | 2.22 | 1.98 | --- ## 3. Key Electronic Functions While the heat sink itself does not have circuitry, its role in an electronic system is critical: * **Thermal Management:** It increases the surface area of a semiconductor, allowing heat to dissipate into the surrounding air via convection. * **Protection:** Prevents "Thermal Throttling" or permanent damage to ICs by keeping junction temperatures within safe operating limits. * **EMI Shielding (Incidental):** Due to its aluminum construction, it can sometimes provide minor electromagnetic interference shielding for the component underneath. --- ## 4. Mechanical Integration The "C2" and "R0" designations in the part number refer to the mounting hardware and material compliance: * **Mounting:** Uses a **Push-Pin** system with a brass or plastic pin and a stainless steel spring. This provides consistent pressure for optimal thermal interface material (TIM) performance. * **Compliance:** Fully **RoHS-6** compliant (Lead-free). * **Interface:** Usually paired with a pre-applied thermal interface material (like T766) to fill microscopic air gaps between the chip and the heat sink. ---