The **ATS-05H-40-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is used to dissipate heat from electronic integrated circuits (ICs), such as CPUs, GPUs, or power transistors. ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-05H-40-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Thermal Resistance** | 14.56°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Design Features #### 1. Heat Sink Type: pushPIN™ This part utilizes the proprietary **pushPIN™** attachment system. This mechanism provides a secure and standardized mounting method, ensuring consistent pressure on the electronic component to optimize thermal transfer. It includes a flexible spring-loaded pin that snaps into the PCB. #### 2. Fin Configuration: XC-CUT The "H" in the part number indicates a specific fin pattern. These are high-density fin arrays designed to maximize surface area within a small footprint. The **XC-CUT** design allows for cross-flow ventilation, making it effective in systems where airflow might come from multiple directions. #### 3. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization layer protects the aluminum from corrosion and slightly improves radiant heat emissivity. #### 4. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This eliminates the need for manual application of thermal paste and ensures that there are no air gaps between the heat-generating component and the heatsink base. --- ### Application in Electronics This heatsink is typically found in: * **Telecommunications:** Networking switches and routers. * **Industrial PC:** Embedded boards requiring low-profile cooling. * **Power Electronics:** Cooling MOSFETs or voltage regulators that generate significant heat in a 45mm x 45mm area.