The **ATS-05H-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the "pushPIN™" series, designed for cooling high-heat-generating components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Type** | Straight | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 10.03°C/W (Unducted @ 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 17.5mm | | **Pitch** | Fine-Pitch | --- ### 2. Design and Component Features #### A. The Fin Profile This model uses a **Straight Fin** design. Straight fins are ideal for applications where the airflow is directed linearly across the heat sink. The "Fine-Pitch" arrangement maximizes the surface area within a small 45mm x 45mm footprint, increasing the efficiency of heat dissipation into the surrounding air. #### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the `-R0` series uses a mechanical attachment system: * **Push Pins:** These are inserted through pre-drilled holes in the PCB. * **Compression Springs:** They ensure a precise, constant pressure between the heat sink and the electronic component, which optimizes thermal transfer. * **Ease of Maintenance:** This allows the heat sink to be removed and reinstalled without damaging the board or leaving residue. #### C. Thermal Interface Material (TIM) This specific part number typically comes with **T766** pre-applied thermal material. The TIM fills microscopic air gaps between the component surface and the aluminum base, significantly reducing thermal resistance. --- ### 3. Part Number Breakdown Understanding the nomenclature helps identify its specific electronic application: * **ATS:** Advanced Thermal Solutions (Manufacturer) * **05:** Series Number * **H:** High Performance * **41:** Specific geometry/model number * **C2:** Material/Finish code (Blue Anodized) * **R0:** Revision/Packaging code --- ### 4. Application Use Cases * **Embedded Systems:** Cooling microprocessors in industrial controllers. * **Telecommunications:** Managing heat in high-speed networking switches. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.