The **ATS-05H-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications Below are the primary mechanical and thermal specifications for this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Base Dimensions** | 25mm x 25mm | | **Height** | 30mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 1.57°C/W (at 200 LFM) | --- ## 2. Key Components & Design Features ### A. Fin Geometry (Straight Fin) The "75" in the part number indicates the specific fin density and arrangement. Straight fin heat sinks are optimized for **forced air cooling** (fans). The vertical channels allow air to flow through with minimal pressure drop, maximizing surface area contact. ### B. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical mounting system: * **Springs:** Ensure constant, high pressure on the component for maximum heat transfer. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB. * **Reliability:** This method is preferred in high-vibration environments compared to thermal tape. ### C. Thermal Interface Material (TIM) The **C3** designation indicates that the part comes with **T766 Phase Change Material** or a similar high-performance thermal pad pre-applied to the base. This fills microscopic air gaps between the component and the heat sink. --- ## 3. Performance Summary The efficiency of the ATS-05H-75-C3-R0 depends heavily on the airflow (Measured in Linear Feet per Minute - LFM): 1. **Low Airflow (200 LFM):** Provides a thermal resistance of approximately **1.57°C/W**. 2. **High Airflow (700 LFM):** Efficiency increases significantly, dropping resistance to roughly **0.70°C/W**. --- ## 4. Common Applications * **Embedded Systems:** Small form-factor industrial PCs. * **Telecommunications:** Networking switches and routers. * **Power Supplies:** Cooling MOSFETs or voltage regulators.