The **ATS-05H-91-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Series** | pushPIN™ HS | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Thermal Resistance** | 21.97°C/W (Unducted Flow @ 100 LFM) | | **Fin Type** | Fine Pitch (Straight Fin) | --- ### 2. Key Features and Components #### A. The Fin Design The "91" in the part number denotes a specific fin pattern. This heat sink uses a **straight fin** design. These are optimized for high-velocity airflow environments where air can be forced through the channels to strip heat away from the aluminum surfaces. #### B. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or complex brackets, this part uses the **pushPIN™ system**: * **Pins:** Usually made of brass or plastic. * **Springs:** Provides consistent "Force-on-Component" to ensure maximum thermal contact and vibration resistance. * **Hole Pattern:** Requires specific pre-drilled holes in the PCB (Printed Circuit Board). #### C. Thermal Interface Material (TIM) The "R0" suffix generally indicates that the part comes with **Pre-applied Thermal Interface Material**. This is a "Phase Change" or "Thermal Pad" material applied to the base, ensuring there are no air gaps between the heat sink and the electronic chip. --- ### 3. Thermal Performance Profile Thermal resistance is critical for choosing the right part. As airflow increases, the efficiency of the ATS-05H-91-C2-R0 improves: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 21.97 | | 300 (1.5 m/s) | 7.40 | | 500 (2.5 m/s) | 4.33 | | 700 (3.5 m/s) | 3.23 | --- ### 4. Typical Applications * **Telecommunications:** Cooling small processors in routers or switches. * **Embedded Systems:** Industrial PCs where space is limited (10mm low profile). * **Power Supplies:** Cooling voltage regulators and MOSFETs.